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US 2006/0131735 A1Published application
Hyper thermally enhanced semiconductor package system
AssigneeSTATS ChipPAC, Ltd.
InventorsYou Yang Ong, Zurina binti Zukiffly, Saat Shukri bin Embong
Life of this patent
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Abstract
A semiconductor package system is provided including mounting a semiconductor chip to a substrate having a substrate opening. A first heat slug is attached to a first surface of the semiconductor chip at least partially encapsulating the semiconductor chip. A second heat slug is attached to the second surface of the semiconductor chip through the substrate opening.
Claims20
A semiconductor package system comprising:
- mounting a semiconductor chip to a substrate having a substrate opening;
- attaching a first heat slug to a first surface of the semiconductor chip, the first heat slug at least partially encapsulating the semiconductor chip;
- and
- attaching a second heat slug to a second surface of the semiconductor chip through the substrate opening.
1 more element
A semiconductor package system comprising:
- mounting a semiconductor chip by flipping and electrically connecting former top bonding pads to a substrate having a substrate opening;
- attaching a top heat slug to a first surface of the semiconductor chip using a conductive bond, the top heat slug at least partially encapsulating the semiconductor chip;
- and
- attaching a bottom heat slug using a conductive bond to a second surface of the semiconductor chip through the substrate opening.
1 more element
A semiconductor package system comprising:
- a semiconductor chip;
- a substrate having a substrate opening, the substrate having the semiconductor chip mounted thereon;
- a first heat slug attached to a first surface of the semiconductor chip, the first heat slug at least partially encapsulating the semiconductor chip;
- and
- a second heat slug attached to a second surface of the semiconductor chip through the substrate opening.
2 more elements
A semiconductor package system comprising:
- a semiconductor chip;
- a substrate having a substrate opening, the substrate having the semiconductor chip flipped and electrically mounted thereon;
- a top heat slug to a first surface of the semiconductor chip using a conductive adhesive, the top heat slug at least partially encapsulating the semiconductor chip;
- and
- a bottom heat slug using a conductive adhesive to a second surface of the semiconductor chip through the substrate opening.
2 more elements
Dependencies are inferred from the claim text.