Multi lead frame power package
AssigneeTexas Instruments Incorporated
InventorsSteven Kummerl, Bernhard Lange, Anthony Coyle
Life of this patent
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Abstract
According to an embodiment of the invention, a system, operable to facilitate dissipation of thermal energy, includes a mold compound, a die, a first lead frame, and a second lead frame. The die is disposed within the mold compound, and in operation generates thermal energy. The first lead frame is disposed at least partially within the mold compound and is operable to facilitate transmission of a signal. The second lead frame is disposed at least partially within the compound, at least partially separated from the first lead frame, and is operable to facilitate a dissipation of thermal energy.
Claims20
A system for facilitating dissipation of thermal energy, the system comprising:
- a mold compound;
- a die disposed within the mold compound, the die in operation generating thermal energy;
- and
- a first lead frame disposed at least partially within the mold compound, wherein
- a wing of the first lead frame is external of the mold compound, and
- the wing is operable to receive thermal energy dissipated from the die through the first lead frame.
A system, operable to facilitate dissipation of thermal energy, the system comprising:
- a mold compound;
- a die disposed within the mold compound, the die in operation generating thermal energy;
- a first lead frame disposed at least partially within the mold compound, wherein the first lead frame is operable to facilitate transmission of a signal;
- and
- a second lead frame disposed at least partially within the mold compound, wherein
- the second lead frame is at least partially separated from the first lead frame, and
- the second lead frame is operable to facilitate a dissipation of thermal energy.
A method of facilitating dissipation of thermal energy away from a die in an integrated circuit package with a mold compound, the method comprising:
- thermally coupling a first lead frame to the die, wherein the first lead frame and the die are at least partially disposed in the mold compound, and the die generates thermal energy;
- extending a wing of the first lead frame external of the mold compound;
- and
- transferring at least a portion of the thermal energy through the first lead frame from the die to the wing.
Dependencies are inferred from the claim text.