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US 2006/0131731 A1Published application
Midair semiconductor device and manufacturing method of the same
AssigneeKabushiki Kaisha Toshiba
InventorTakao Sato
Life of this patent
Estimating the term…
Abstract
A midair semiconductor device includes a Si substrate provided with an element part on its front surface side. An opening is formed in the Si substrate in such a manner that a rear surface of the element part is exposed. The opening is provided below the element part while penetrating through the Si substrate. The front surface side of the Si substrate is sealed with a first cap part such as a Si cap such that a portion above the element part is brought into a midair state. A second cap part such as a Si cap is bonded to the rear surface side of the Si substrate so that the opening is sealed.
Claims18
A midair semiconductor device, comprising:
- an element structure part which includes a semiconductor substrate, an element part provided on a front surface side of the semiconductor substrate, and an opening formed penetrating through the semiconductor substrate in such a manner that a rear surface of the element part is exposed;
- a first cap part which seals the front surface side of the semiconductor substrate such that a portion above the element part is brought into a midair state;
- and
- a second cap part which seals the opening from a rear surface side of the semiconductor substrate.
1 more element
A midair semiconductor device, comprising:
- an element structure part which includes a semiconductor substrate, an element part provided on a front surface side of the semiconductor substrate, an electrode part provided on the front surface side of the semiconductor substrate and connected to the element part, a connection plug connected to the electrode part while penetrating through the semiconductor substrate, an external connection terminal provided on a rear surface side of the semiconductor substrate so as to connect with the connection plug, and an element-side metal sealing part formed on the front surface side of the semiconductor substrate so as to surround a periphery of the element part;
- and
- a cap part which includes a cap substrate with which sealing is made such that a portion above the element part is brought into a midair state, and a cap-side metal sealing part formed on the cap substrate so as to be in contact with the element-side metal sealing part.
A midair semiconductor device, comprising:
- an element structure part which includes a semiconductor substrate, an element part provided on a front surface side of the semiconductor substrate, an electrode part provided on the front surface side of the semiconductor substrate and connected to the element part, and an element-side metal sealing part formed on the front surface side of the semiconductor substrate so as to surround a periphery of the element part;
- and
- a cap part which includes a cap substrate with which sealing is made such that a portion above the element part is brought into a midair state, a connection plug formed penetrating the cap substrate in a position in contact with the electrode part, an external connection terminal provided on a surface on a side opposite to a surface facing the element part of the cap substrate and connected to the connection plug, and a cap-side metal sealing part formed on the cap substrate so as to be in contact with the element-side metal sealing part,
- wherein the electrode part and the element-side metal sealing part include a first metal material of a same kind, and a connection surface of the connection plug and the cap-side metal sealing part include a second metal material of a same kind which constitutes a low-melting metal in combination with the first metal material.
1 more element
A manufacturing method of a midair semiconductor device, comprising:
- forming a plurality of element parts on a front surface side of a semiconductor substrate;
- bonding a plurality of individually separated cap parts to the semiconductor substrate, respectively, in such a manner that the plurality of element parts are sealed individually;
- bonding the semiconductor substrate to a support substrate via a resin protectant which absorbs irregularities caused by the plurality of cap parts;
- machining a rear surface of the semiconductor substrate bonded to the support substrate;
- and
- cutting the machined semiconductor substrate according to the plurality of element parts to fabricate a midair semiconductor device in which the element part is sealed with the cap part.
3 more elements
Dependencies are inferred from the claim text.