Arrangement of input/output pads on an integrated circuit

An integrated circuit comprising:

• input/output pads arranged in a configuration around a perimeter of the core circuitry, so that input/output pad bond openings are each rectangular in shape having a height in a direction perpendicular to the perimeter of the core circuitry and having a width in a direction parallel to the perimeter of the core circuitry;
• wherein the input/output pads are arranged so that a first group of the input/output pad bond openings are located at a first distance from the core circuitry and a second group of the input/output pad bond openings are located at a second distance from the core circuitry;
• wherein height for the input/output pad bond openings within the first group is greater than width for the input/output pad bond openings within the first group;
• and,
• wherein height for the input/output pad bond openings within the second group is less than width for the input/output pad bond openings within the second group.