System for implementing a configurable integrated circuit
AssigneeLSI Logic Corporation
InventorsAnwar Ali, Julie Beatty, Kalyan Doddapaneni
Life of this patent
Estimating the term…
Abstract
The present invention provides a system for implementing a configurable integrated circuit (IC). Aspects of the invention include an IC die; a plurality of input/outputs (I/Os) coupled to the IC die; and a plurality power planes coupled to the IC die for providing power to the plurality of I/Os at different voltages. The plurality of power planes are configured concentrically around the IC die so that any one or more of the I/Os at any location on the IC die can be individually configured to connect to any of the power planes. As a result, any number of I/Os available on the IC die can operate at a given voltage.
Claims19
(canceled)
The system of claim 6 wherein any number of I/Os can be configured to connect to any one power plane.
The system of claim 6 further comprising a plurality of I/O segments coupled to the plurality power planes, wherein each I/O segment comprises a plurality of I/Os, and wherein the number of I/Os an I/O segment can vary from I/O segment to I/O segment.
The system of claim 6 wherein concentric power planes are on different layers of the die and connected to the I/Os through metal interconnects.
(canceled)
A system for implementing a configurable integrated circuit (IC), the system comprising:
- an IC die:
- a plurality of input/outputs (I/Os) coupled to the IC die;
- and a plurality of power planes coupled to the IC die for providing power to the plurality of I/Os at different voltages, wherein the plurality of power planes are each configured concentrically around the IC die so that any one or more of the I/Os at any location on the IC die can be individually configured to connect to any of the power planes, wherein each power plane is configured as a ring, wherein the ring is polygonal.
(canceled)
(canceled)
The wirebond package of claim 13 wherein any number of I/Os can be configured to connect to any one power ring.
The wirebond package of claim 13 further comprising a plurality of I/O segments coupled to the plurality power rings, wherein each I/O segment comprises a plurality of I/Os, and wherein the number of I/Os an I/O segment can vary from I/O segment to I/O segment.
The wirebond package of claim 13 wherein concentric power rings are on different layers of the die and connected to the I/Os through metal interconnects.
A wirebond package comprising:
- an IC die;
- a plurality of input/outputs (I/Os) coupled to the IC die;
- and a plurality of power rings coupled to the IC die for providing power to the plurality of I/Os at different voltages, wherein each the plurality of power rings are configured concentrically around the IC die so that any one or more of the I/Os at any location on the IC die can be individually configured to connect to any of the power rings, wherein the power ring is polygonal.
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
Dependencies are inferred from the claim text.