Multi-level semiconductor module

A multi-level semiconductor module formed by alternately stacking one or more resin boards and one or more sheet members, each of the resin boards including a plurality of first buried conductors and having an upper face on which a semiconductor chip is mounted, each of the sheet members having an opening for accommodation of the semiconductor chip and including a plurality of second buried conductors electrically connected to the first buried conductors, wherein the first buried conductors are arranged to form a plurality of lines surrounding a mounting region on which the semiconductor chip is mounted, and

• a minimum distance between adjacent two of the lines formed by the first buried conductors increases in succession from an innermost line toward an outermost line out of the lines.

A multi-level semiconductor module formed by alternately stacking one or more resin boards and one or more sheet members, each of the resin boards including a plurality of first buried conductors and having an upper face on which a semiconductor chip is mounted, each of the sheet members having an opening for accommodation of the semiconductor chip and including a plurality of second buried conductors electrically connected to the first buried conductors, wherein the first buried conductors surround a mounting region on which the semiconductor chip is mounted, and

• the diameter of the first buried conductors increases in succession toward the mounting region.

A multi-level semiconductor module formed by alternately stacking one or more resin boards and one or more sheet members, each of the resin boards including a plurality of first buried conductors and having an upper face on which a semiconductor chip is mounted, each of the sheet members having an opening for accommodation of the semiconductor chip and including a plurality of second buried conductors electrically connected to the first buried conductors, wherein the first buried conductors are arranged to form a plurality of lines surrounding a mounting region on which the semiconductor chip is mounted, and

• the diameter of some of the first buried conductors diagonally arranged in each of the resin boards is larger than or equal to that of the other first buried conductors and increases in succession toward the mounting region.