Semiconductor device manufacturing method, semiconductor device, laminated semiconductor device, circuit substrate, and electronic apparatus

A semiconductor device manufacturing method comprising:

• affixing a semiconductor wafer, which includes a plurality of semiconductor element sections which a conductive material is buried in, to a supporting body via an adhesive layer;
• forming a penetrating electrode which penetrates the plurality of semiconductor element sections and has the conductive material, by thinning the semiconductor wafer;
• cutting the semiconductor wafer so that the supporting body remains, and dividing the semiconductor wafer into the plurality of semiconductor element sections;
• forming a resin layer which selectively covers side walls and corners of the plurality of semiconductor element sections formed by cutting the semiconductor wafer;
• and
• peeling the semiconductor element sections from the supporting body.