Package for semiconductor device

Abstract

A lid for sealing a ceramic container receiving a semiconductor device such as an acceleration sensor is provided. The lid has an electrodeposition coating layer having a thickness of approximately 10 μm, which is formed by plating the outer surface of the 42 alloy plate having a thickness of approximately 100 μm with chrome and by forming a black color compound at the chrome plating layer. The lid is fixed to the upper end of a sidewall part of the ceramic container by means of a thermosetting resin. The thickness of the thermosetting resin after thermosetting is adjusted to be approximately 20 to 30 μm. The conventional ceramic lid needs 200 μm or more in thickness in view of strength, and has difficulty in laser processing. The lid of the present invention allows decreasing the thickness by half, and facilitating the imprint by laser.

Dependencies are inferred from the claim text.