Semiconductor die positioning system and a method of bonding a semiconductor die to a substrate
OwnerMichael Caron, Samuel Nablo +2inventors
InventorsMichael Caron, Samuel Nablo, John Frazier, John Vogt
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Abstract
The present invention describes a process for bonding a semiconductor die to a selected substrate, including the formation of a die positioning structure on the substrate to receive and secure the semiconductor die. The substrate is selected from a number of materials, the properties of which render it penetrable by electron beam radiation. The die positioning structure is a second material which is electron beam curable, and which is deposited and cured at high speed on the substrate in a novel fashion in accordance with the present invention in a highly efficient reproducible and economical manner.
Claims30
A method of bonding a semiconductor die to a substrate, the method comprising:
- providing a substrate having at least one lead disposed thereon;
- providing an E-beam curable material;
- providing a negative cast of a die positioning structure;
- pressing the E-beam curable material between the substrate and the negative cast, thereby providing a die positioning structure;
- curing the E-beam curable material by E-beam irradiation through the substrate, thereby providing a cured die positioning structure;
- and
- bonding a semiconductor die within the cured die positioning structure.
A die positioning system comprising:
- a substrate having a plurality of electrical leads formed thereon;
- a die positioning structure disposed on the substrate, the die positioning structure adapted to receive a semiconductor die;
- and
- wherein the die positioning structure is comprised of an E-beam curable material.
An electronic device comprising:
- a substrate having a plurality of electrical leads formed thereon,
- a die positioning structure disposed on the substrate, the die positioning structure comprised of an electron-beam curable material and adapted to receive a semiconductor die;
- and
- a semiconductor die having a plurality of bonding pads, the semiconductor die disposed within the die positioning structure and electrically connected to the plurality of electrical leads.
Dependencies are inferred from the claim text.