Packaged electronic devices, and method for making same
OwnerKee Ng, Hui Koay +1inventors
InventorsKee Ng, Hui Koay, Yew Kuan
Life of this patent
Estimating the term…
Abstract
In one embodiment, an electronic device is packaged by electrically connecting the electronic device to an electrical contact on a substrate; applying a binding agent to bind the electronic device to the electrical contact; and then removing at least a portion of the substrate to expose the electrical contact as a package contact. The substrate may take various forms and may be removed in a variety of ways, which include chemical and mechanical processes. In some embodiments, the electrical contact may have a non-uniform thickness and may be provided with a reinforcement rib or a slotted profile.
Claims20
A method for packaging an electronic device, comprising:
- electrically connecting an electronic device to an electrical contact on a substrate;
- applying a binding agent to bind the electronic device to the electrical contact;
- and
- removing at least a portion of the substrate to expose the electrical contact as a package contact.
A packaged electronic device, comprising:
- an electronic device;
- an electrical contact, electrically connected to the electronic device;
- and
- a binding agent binding the electronic device to the electrical contact, wherein the binding agent provides a package for the electronic device, and wherein the electrical contact is embedded in and exposed on a surface of the binding agent.
A packaged electronic device, comprising:
- an electronic device;
- an electrical contact formed on a substrate, the electrical contact being electrically connected to the electronic device;
- and
- a binding agent binding the electronic device to the electrical contact, wherein at least a portion of the substrate has been removed to expose the electrical contact as a package contact.
Dependencies are inferred from the claim text.