Back to results
US 2006/0131706 A1Published application
Methods of making and using a floating lead finger on a lead frame
AssigneeMicron Technology, Inc.
InventorDavid Corisis
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
AssigneeMicron Technology, Inc.
InventorDavid Corisis
Estimating the term…
A semiconductor device assembly includes a semiconductor device and a lead frame having lead fingers for connection to the semiconductor device. The lead frame may include floating NC lead fingers with inner portions of the floating NC lead fingers electrically isolated from the semiconductor device and the associated outer portion of the floating NC lead fingers. Floating NC lead fingers may separate lead fingers prone to causing induction noise from lead fingers subject to induction effects. The floating NC lead fingers may thus reduce the inductance noise of the lead fingers. The floating NC lead fingers may also allow the semiconductor device to be securely adhered to the lead fingers with no air pockets therebetween. A method of forming a semiconductor device assembly is also provided.
A method of reducing an inductance associated with leads of a lead frame in an integrated circuit package, the method comprising:
A method of making an integrated circuit package including a lead frame, the method comprising:
A method of securely adhering a plurality of lead fingers to an active surface of a semiconductor device, the method comprising:
Dependencies are inferred from the claim text.