Connection, configuration, and production of a buried semiconductor layer
AssigneeInfineon Technologies AG
InventorThorsten Meyer
Life of this patent
Estimating the term…
Abstract
In one embodiment, a power transistor has a semiconductor volume including a plurality of transistor cells connected in parallel, a laterally oriented, highly conductive semiconductor layer buried below the transistor cells in the semiconductor volume, and at least one connection, via which the buried semiconductor layer can be contact-connected from the top side of the power transistor. At least one connection is formed within a trench extending from the top-side of the power transistor towards the buried semiconductor layer.
Claims27
A power transistor, having a semiconductor volume comprising:
- a plurality of transistor cells connected in parallel;
- a laterally oriented, highly conductive semiconductor layer buried below the transistor cells in the semiconductor volume;
- and
- at least one connection, via which the buried semiconductor layer can be contact-connected from a top side of the power transistor;
- wherein at least one connection is formed within a trench extending from the top side of the power transistor towards the buried semiconductor layer.
A power transistor having a semiconductor volume comprising:
- a plurality of transistor cells connected in parallel and isolated from one another by trenches;
- a laterally oriented, highly conductive semiconductor layer buried below the transistor cells in the semiconductor volume;
- and
- means for contact-connecting the buried semiconductor layer from the top side of the power transistor;
- wherein at least one trench reaches into the buried semiconductor layer, the trench bottom of the at least one trench being lined with a highly conductive layer.
A method for producing a power transistor comprising:
- providing a plurality of transistor cells connected in parallel;
- burying a laterally oriented, highly conductive semiconductor layer below the transistor cells in a semiconductor volume;
- and
- forming a connection, via which the buried semiconductor layer can be contact-connected from a top side of the power transistor, in a trench extending from the top side of the power transistor toward the buried semiconductor layer;
- wherein the buried semiconductor layer are produced by:
- forming a plurality of trenches in the semiconductor volume;
- and
- applying dopants to the surface of the semiconductor volume in such a way that dopants enter into the semiconductor volume through the inner walls in the lower region of the trenches.
Dependencies are inferred from the claim text.