Back to results
US 2006/0131611 A1Published application
Multi-layer printed circuit board comprising a through connection for high frequency applications
AssigneeAdvanced Micro Devices, Inc.
InventorsHeiko Kaluzni, Andreas Huschka
Life of this patent
Estimating the term…
Abstract
A high frequency multi-layer printed circuit board, according to the present invention, comprises a through connection having an impedance adapting structure surrounding the through connection and enabling an adjustment of the characteristic impedance of the through connection to a desired value. Thus, high frequency signals may be led through the printed circuit board with reduced signal deformation. The high frequency multi-layer printed circuit board is applicable for high frequency signals up to the GHz-range.
Claims51
A high frequency multi-layer printed circuit board, comprising:
- a layer stack comprising a first metal-comprising layer, a second metal-comprising layer and at least one dielectric layer separating said first and second metal-comprising layers;
- and
- a transition structure comprising:
- a through connection extending from said first metal-comprising layer through said at least one dielectric layer to said second metal-comprising layer;
- and
- an impedance adapting structure surrounding said through connection at least partially and providing a characteristic impedance of said transition structure, said characteristic impedance being adapted to a desired impedance value.
3 more elements
A high frequency multi-layer printed circuit board, comprising:
- a layer stack comprising a first metal-comprising layer, a second metal-comprising layer and at least one dielectric layer separating the first and second metal-comprising layers;
- and
- a transition structure comprising:
- a through connection extending from said first metal-comprising layer through said at least one dielectric layer to said second metal-comprising layer;
- and
- an impedance adapting structure formed in said first and second metal-comprising layers, wherein said first and second metal-comprising layers comprise substantially concentric metal-free regions surrounded by metal-containing regions, said metal-free regions being substantially coaxially aligned to said through connection and having a diameter being adapted to a desired value of the characteristic impedance of said transition structure.
3 more elements
A high frequency multi-layer printed circuit board, comprising:
- a layer stack comprising a first metal-comprising layer and a second metal-comprising layer, at least one metal-comprising inner layer disposed between said first and second metal-comprising layers, and at least two dielectric layers separating said metal-comprising layers;
- and
- a transition structure comprising:
- a through connection extending from said first metal-comprising layer through said at least one metal-comprising inner layer and said at least two dielectric layers to said second metal-comprising layers;
- and
- an impedance adapting structure formed in said inner metal-comprising layer, wherein said inner metal-comprising layer comprises a substantially concentric metal-free region surrounded by a metal-containing region, said metal-free region being substantially coaxially aligned to said through connection and having a diameter being adapted to a desired value of the characteristic impedance of said transition structure.
3 more elements
A high frequency multi-layer printed circuit board, comprising:
- a layer stack comprising a first metal-comprising layer and a second metal-comprising layer, at least two metal-comprising inner layers disposed between the first and second metal-comprising layers, and at least three dielectric layers separating the metal-comprising layers;
- and
- a transition structure comprising:
- a through connection extending from said first metal-comprising layer through said at least two metal-comprising inner layers and said at least three dielectric layers to said second metal-comprising layer;
- and
- a impedance adapting structure connecting at least two of said at least two metal-comprising inner layers conductively by a plurality of coaxial vias arranged on a substantially concentric circular line that is substantially coaxially aligned with said through connection.
3 more elements
A high frequency device, comprising:
- an integrated high frequency circuit die comprising a high frequency terminal;
- and
- a high frequency multi-layer printed circuit board comprising a transition structure, wherein the integrated high frequency circuit die is mounted on said high frequency multi-layer printed circuit board and said high frequency terminal is connected to said transition structure, wherein said transition structure comprises a through connection and an impedance adapting structure.
A method of manufacturing a high frequency multi-layer printed circuit board, the method comprising:
- choosing a desired impedance value;
- forming a layer stack comprising at least a first metal-comprising layer and a second metal-comprising layer and at least one dielectric layer separating said first and second metal-comprising layers;
- forming a through connection extending from said first metal-comprising layer through said at least one dielectric layer to said second metal-comprising layer;
- and
- forming an impedance adapting structure surrounding said through connection at least partially and adapting therewith the characteristic impedance of a transition structure to said desired impedance value, wherein the transition structure is comprised of said through connection and said impedance adapting structure.
2 more elements
Dependencies are inferred from the claim text.