Light transmitting window member, semiconductor package provided with light transmitting window member and method for manufacturing light transmitting window member
OwnerJunichi Nakaoka, Kenji Ikeuchi +1inventors
InventorsJunichi Nakaoka, Kenji Ikeuchi, Makoto Takahashi
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Abstract
A light transmission window member capable of simplifying the structure and capable of simplifying manufacturing steps is obtained. This light transmission window member (10, 10a), which is a light transmission window member employed for a semiconductor package (30, 30a), comprises a flat metal frame (2) having an opening (2a) for defining a light passage region and a glass member (1) capable of transmitting light bonded to the upper surface of the flat frame having the opening without through an adhesive to cover the opening.
Claims22
A light transmission window member (10, 10a) employed for a semiconductor package (30, 30a), comprising:
- a flat metal frame (2) having an opening (2a) for defining a light passage region;
- and
- a glass member (1) capable of transmitting light bonded to the upper surface of the flat frame having said opening without through an adhesive to cover said opening.
A semiconductor package (30, 30a) comprising a light transmission window member (10, 10a) including:
- a flat metal frame (2) having an opening (2a) for defining a light passage region;
- and
- a glass member (1) capable of transmitting light bonded to the upper surface of the flat frame having said opening without through an adhesive to cover said opening.
The semiconductor package according to claim 111 or 12, wherein said lass member is anodically bonded to the upper surface of said flat frame.
A method of manufacturing a light transmission window member (10, 10a) employed for a semiconductor package (30, 30a), comprising steps of:
- preparing a flat metal frame (2) having an opening (2a) for defining a light passage region;
- and
- anodically bonding a glass member (1) capable of transmitting light to the upper surface of the flat frame having said opening to cover said opening.
Dependencies are inferred from the claim text.