Process to improve transistor drive current through the use of strain

Abstract

The present invention provides, in one embodiment, a P-type Metal Oxide Semiconductor (PMOS) device (100). The device (100) comprises a tensile-strained silicon layer (105) located on a silicon-germanium substrate (110) and silicon-germanium source/drain structures (135, 140) located on or in the tensile-strained silicon layer (105). The PMOS device (100) further includes a channel region (130) located between the silicon-germanium source/drain structures (135, 140) and within the tensile-strained silicon layer (105). The channel region (130) has a compressive stress (145) in a direction parallel to an intended current flow (125) through the channel region (130). Other embodiments of the present invention include a method of manufacturing the PMOS device (200) and a MOS device (300).

Dependencies are inferred from the claim text.