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US 2006/0131577 A1Published application
Isolation circuit
AssigneeMicron Technology, Inc.
InventorsTimothy Cowles, Aron Lunde
Life of this patent
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Abstract
An isolation circuit includes a first pad adapted to receive a control signal and a second pad adapted to receive another signal. A third pad is coupled to a microelectronic die and a device is provided to transfer the other signal from the second pad to the third pad in response to the control signal.
Claims25
An isolation circuit, comprising:
- a wireless identification circuit;
- a first pad adapted to receive a test signal;
- a second pad coupled to a microelectronic die;
- and
- a first device adapted to transfer the test signal from the first pad to the second pad in response to a signal from the wireless identification circuit.
2 more elements
An isolation circuit, comprising:
- a first pad to receive a signal;
- a second pad coupled to a microelectronic die;
- a first device adapted to transfer the signal from the first pad to the second pad in response to a control signal;
- and
- a second device to selectively prevent the first pad from being coupled to the second pad.
2 more elements
A microelectronic die, comprising:
- a first pad to receive a test signal during testing of at least one component formed on the microelectronic die;
- a second pad coupled to the at least one component;
- a first device adapted to transfer the test signal from the first pad to the second pad in response to a control signal;
- and
- a second device to selectively prevent the first pad from being coupled to the second pad during a predetermined use of the microelectronic die.
2 more elements
A semiconductor wafer, comprising:
- a plurality of microelectronic dies;
- and
- at least one isolation circuit associated with each microelectronic die, the at least one isolation circuit including:
- a first pad to receive a test signal during testing of the associated microelectronic die;
- a second pad coupled to the associated microelectronic die;
- a first device adapted to transfer the test signal from the first pad to the second pad in response to a control signal;
- and
- a second device to selectively prevent the first pad from being coupled to the second pad a predetermined use of the microelectronic die.
5 more elements
An electronic system, comprising:
- a processor;
- and
- a memory system coupled to the processor, wherein at least one of the processor and the memory system are formed on a microelectronic die including an isolation circuit, the isolation circuit including:
- a first pad to receive a test signal during testing of the system;
- a second pad coupled to the at least one of the processor and the memory system;
- a first device adapted to transfer the test signal from the first pad to the second pad in response to a control signal;
- and
- a second device to selectively prevent the first pad from being coupled to the second pad during normal operations of the electronic system.
5 more elements
Dependencies are inferred from the claim text.