Optical integrated circuit package

Abstract

An optical device and method for making the same is disclosed. The device includes having a circuit element that is located in an opaque enclosure. The circuit element includes a die having an optical integrated circuit mounted on a carrier. The carrier includes a plurality of conductors connected to the optical integrated circuit. The opaque enclosure has a transparent window therein. The carrier is positioned in the enclosure such that light entering the enclosure through the window illuminates the die. The enclosure further includes an aperture through which the conductors protrude from the enclosure. The enclosure is at least partially filled with a layer of optically transparent material that passes light utilized or generated by said optical integrated circuit. The enclosure can be preformed to a higher degree of precision than that obtainable on conventional packaging fabrication lines.

Dependencies are inferred from the claim text.