Back to results
US 2006/0131426 A1Published application
RFID tag and method of manufacturing the same
AssigneeFujitsu Limited
InventorsNaoki Ishikawa, Shunji Baba, Hidehiko Kira, Hiroshi Kobayashi
Life of this patent
Estimating the term…
Abstract
The present invention provides a radio frequency identification (RFID) tag which exchanges information with an external device in a noncontact manner, in which a paste is used as a material for an antenna, and which is designed to prevent sinking of bumps. A stopper for limiting sinking of bumps of a circuit chip caused by a pressing force when the circuit chip is connected to an antenna is provided on the circuit chip or a base at a position adjacent to the bumps.
Claims13
An RFID tag comprising:
- a base;
- an antenna for communication provided on the base;
- a circuit chip connected to the antenna through bumps, the circuit chip performing wireless communication through the antenna,
- wherein the antenna is formed of a paste in which a metallic filler is blended with a resin material;
- and
- a stopper for limiting sinking of the bumps caused by a pressing force when the circuit chip with the bumps is connected to the antenna is provided adjacent to the bumps.
3 more elements
An RFID tag comprising:
- a base;
- an antenna for communication provided on the base;
- a circuit chip connected to the antenna through bumps, the circuit chip performing wireless communication through the antenna,
- wherein the antenna is formed of a paste in which a metallic filler is blended with a resin material;
- and
- a hard layer for limiting sinking of the bumps caused by a pressing force when the circuit chip with the bumps is connected to the antenna is provided at least at positions right below the bumps between the base and the antenna.
3 more elements
An RFID tag comprising:
- a base;
- an antenna for communication provided on the base;
- a circuit chip connected to the antenna through bumps, the circuit chip performing wireless communication through the antenna,
- wherein the antenna is formed of a paste in which a metallic filler is blended with a resin material;
- and
- an electroconductive support for limiting sinking of the bumps caused by a pressing force when the circuit chip with the bumps is connected to the antenna is provided between the antenna and the bumps.
3 more elements
An RFID tag comprising:
- a base;
- an antenna for communication provided on the base;
- and
- a circuit chip connected to the antenna through bumps, the circuit chip performing wireless communication through the antenna,
- wherein the antenna is formed of a paste in which a metallic filler is blended with a resin material, and portions of the antenna right below the bumps are formed of a paste in which the ratio of blending of the metallic filler is changed in comparison with that in the paste for the portion other than the portions right below the bumps to limit sinking of the bumps caused by a pressing force when the circuit chip with the bumps is connected to the antenna.
2 more elements
An RFID tag comprising:
- a base;
- an antenna for communication provided on the base;
- and
- a circuit chip connected to the antenna through bumps, the circuit chip performing wireless communication through the antenna,
- wherein the antenna is formed of a paste in which a metallic filler for giving the necessary conductivity for the antenna to a resin material is blended with the resin material, and a hard filler for limiting sinking of the bumps caused by a pressing force when the circuit chip with the bumps is connected to the antenna is also blended with the resin material.
2 more elements
A method of manufacturing an RFID tag, comprising:
- an antenna printing step of printing an antenna for communication on a base by using a paste in which a metallic filler is blended with a resin material;
- a circuit chip mounting step of mounting a circuit chip with bumps capable of performing wireless communication through the antenna, the circuit chip and the antenna being connected to each other through the bumps;
- and
- a stopper forming step of forming at a position adjacent to the bumps a stopper for limiting sinking of the bumps caused by a pressing force when the circuit chip with the bumps is connected to the antenna.
1 more element
A method of manufacturing an RFID tag, comprising:
- an antenna printing step of printing an antenna for communication on a base by using a paste in which a metallic filler is blended with a resin material;
- a circuit chip mounting step of mounting a circuit chip with bumps capable of performing wireless communication through the antenna, the circuit chip and the antenna being connected to each other through the bumps;
- and
- a hard layer forming step of forming, at least at positions right below the bumps, between the base and the antenna, a hard layer for limiting sinking of the bumps caused by a pressing force when the circuit chip with the bumps is connected to the antenna.
1 more element
A method of manufacturing an RFID tag, comprising:
- an antenna printing step of printing an antenna for communication on a base by using a paste in which a metallic filler is blended with a resin material;
- a circuit chip mounting step of mounting a circuit chip with bumps capable of performing wireless communication through the antenna, the circuit chip and the antenna being connected to each other through the bumps;
- and
- a support forming step of forming between the antenna and the bumps an electroconductive support for limiting sinking of the bumps caused by a pressing force when the circuit chip with the bumps is connected to the antenna.
1 more element
A method of manufacturing an RFID tag, comprising:
- an antenna printing step of printing an antenna for communication on a base by using a paste in which a metallic filler is blended with a resin material;
- and
- a circuit chip mounting step of mounting a circuit chip with bumps capable of performing wireless communication through the antenna, the circuit chip and the antenna being connected to each other through the bumps,
- wherein the antenna printing step includes a first printing step of printing a portion of the antenna other than the portions to which the bumps are connected by using the paste in which the metallic filler is blended with the resin material, and a second printing step of printing the portions of the antenna to which the bumps are connected by using a paste in which the ratio of blending of the filler is changed in comparison with that in the paste used in the first printing step so as to form on the portions of the antenna to which the bumps are connected a hard electroconductive film for limiting sinking of the bumps caused by a pressing force when the circuit chip with the bumps is connected to the antenna.
1 more element
A method of manufacturing an RFID tag, comprising:
- an antenna printing step of printing an antenna for communication on a base by using a paste in which a metallic filler is blended with a resin material;
- and
- a circuit chip mounting step of mounting a circuit chip with bumps capable of performing wireless communication through the antenna, the circuit chip and the antenna being connected to each other through the bumps,
- wherein the antenna printing step is a step of printing the antenna for communication on the base by using a paste in which a metallic filler for giving the necessary conductivity for the antenna to the resin material is blended with the resin material, and a hard filler for limiting sinking of the bumps caused by a pressing force when the circuit chip with the bumps is connected to the antenna is also blended with the resin material.
1 more element
Dependencies are inferred from the claim text.