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US 2006/0131367 A1Published application
Low thermal resistance junction processing
OwnerFrederick Leeinventor
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Abstract
A method for reducing thermal resistance at a junction between two types of metallic material is provided. The method mainly forms a capillary structure between the two surfaces of the two identical or different types of metallic material. The method then adds and melts an appropriate amount of soldering paste at the junction so as to bind the two types of metallic material together. The invention could achieve superior structural strength and thermal conductivity at the junction.
Claims7
A junction processing for lowering thermal resistance between two types of metallic material comprising the steps of:
- forming a capillary structure between surfaces of said two types of metallic material;
- adding an appropriate amount of soldering paste between said surfaces;
- and
- melting said soldering paste by increasing temperature so as to bind said two types of metallic material together.
1 more element
Dependencies are inferred from the claim text.