Processing a memory link with a set of at least two laser pulses
OwnerYunlong Sun, Edward Swenson +1inventors
InventorsYunlong Sun, Edward Swenson, Richard Harris
Life of this patent
Estimating the term…
Abstract
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.
Claims36
A method for laser severing a conductive link in an integrated circuit (IC), the method comprising:
- providing position data representative of locations of one or more conductive links;
- generating at least two laser pulses, the laser pulses including a first laser pulse and a second laser pulse;
- and
- sequentially directing on-the-fly, based on the position data, the first and second laser pulses to a selected conductive link to sever the selected conductive link.
A method for laser severing a conductive link in an integrated circuit (IC), the method comprising:
- providing position data representative of locations of one or more conductive links;
- generating at least two laser pulses, the laser pulses including a first laser pulse and a second laser pulse, wherein each of the laser pulses have energy characteristics;
- and
- sequentially directing, on-the-fly, based on the position data, the first an second laser pulses to a selected conductive link to sever the selected conductive link, wherein the number of laser pulses and the energy characteristics of each of the laser pulses are determined as a function of the thickness of the selected conductive link to be severed.
A method for laser severing a conductive link in an integrated circuit (IC), the method comprising:
- providing position data representative of locations of one or more conductive links having respective link widths that are less than or equal to about 1 μm;
- generating at least two laser pulses, the laser pulses including a first laser pulse and a second laser pulse;
- and
- sequentially directing on-the-fly, based on the position data, the first and second laser pulses to a selected conductive link to sever the selected conductive link.
Dependencies are inferred from the claim text.