# US 2006/0131283 A1 · Method and apparatus for forming angled vias in an integrated circuit package substrate

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- Number: US 2006/0131283 A1
- Document ID: US20060131283A1
- Status: Published application
- Kind: A1
- Application number: 11/016,440
- Filed: 2004-12-17
- Published: 2006-06-22
- Earliest claimed: 2004-12-17
- Assignees: LSI Logic Corporation
- Inventors: Jeffrey Hall; Yogendra Ranade; Sarathy Rajagopalan
- Web page: https://patentgrep.com/patent/US20060131283A1

## CPC

- H10W 70/095: {of vias therein}
- H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H05K 3/0032: {of organic insulating material}
- H05K 3/0047: {Drilling of holes}
- H05K 3/42: Plated through-holes {or plated via connections}
- H05K 2201/09836: Oblique hole, via or bump
- H10W 70/635: {Through-vias}
- H10W 70/655: Fan-out layouts
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 408/86: Tool-support with means to permit positioning of the Tool relative to support
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method and apparatus for making angled vias in an integrated circuit package substrate includes providing an integrated circuit package substrate having an upper surface and a lower surface. A first position is selected for a first via opening on the upper surface of the package substrate, and a second position is selected for a second via opening on the lower surface of the package substrate. A selected non-vertical angle is determined for forming an angled via through the first position and the second position. The angled via is formed through the first position and the second position at the selected non-vertical angle.

## Claims

### Claim 1

A method comprising steps of:
(a) providing a package substrate having an upper surface and a lower surface;
(b) selecting a first position for a first via opening on the upper surface of the package substrate;
(c) selecting a second position for a second via opening on the lower surface of the package substrate;
(d) determining a selected non-vertical angle for forming an angled via through the first position and the second position; and
(e) forming the angled via through the first position and the second position of the package substrate at the selected non-vertical angle.

### Claim 2 (depends on 1)

The method of claim 1 wherein step (e) comprises forming the angled via with a mechanical drill.

### Claim 3 (depends on 1)

The method of claim 1 wherein step (e) comprises forming the angled via with a laser drill.

### Claim 4 (depends on 1)

The method of claim 1 wherein step (d) comprises calculating an arctangent of a ratio of a coordinate distance between the first via opening and the second via opening and a thickness of the package substrate.

### Claim 5 (depends on 1)

The method of claim 1 wherein step (e) comprises calculating a correction to the first location so that the entry point of a drill for forming the angled via coincides with the first location at the selected non-vertical angle.

### Claim 6

An apparatus comprising:
a positioning device for establishing a relative position between an integrated circuit package substrate and a drill; and
a tilting device coupled to the positioning device for selecting a non-vertical angle between the drill and the package substrate to form an angled via through the package substrate at the selected non-vertical angle.

### Claim 7 (depends on 6)

The apparatus of claim 6 wherein the positioning device comprises a mechanical table.

### Claim 8 (depends on 6)

The apparatus of claim 6 wherein the tilting device comprises a tilting drill assembly.

### Claim 9 (depends on 6)

The apparatus of claim 6 wherein the tilting device comprises a tilting drill table.

### Claim 10 (depends on 6)

The apparatus of claim 6 wherein the drill is a mechanical drill.

### Claim 11 (depends on 6)

The apparatus of claim 6 wherein the drill is a laser drill.