Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

A system configured to monitor a parameter of a measurement device, comprising:

• a measurement device configured to scan a specimen during polishing of the specimen to generate output signals at measurement spots on the specimen;
• and
• a processor coupled to the measurement device, wherein the processor is configured to determine if the output signals are outside of a range of output signals, and wherein output signals outside of the range indicate that the parameter of the measurement device is outside of control limits for the parameter.

A method for monitoring a specimen during polishing, comprising:

• scanning the specimen with a measurement device during said polishing to generate output signals at measurement spots on the specimen;
• and
• determining if the output signals are outside of a range of output signals, wherein output signals outside of the range indicate damage to the specimen.

A system configured to monitor a specimen during polishing, comprising:

• an eddy current device configured to scan a specimen during said polishing to generate output signals at measurement spots on the specimen;
• and
• a processor coupled to the eddy current device, wherein-the processor is configured to determine if the output signals are outside of a range of output signals, and wherein output signals outside of the range indicate damage to the specimen.

A method for determining a characteristic of a polishing pad, comprising:

• scanning the polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad;
• and
• determining the characteristic of the polishing pad from the output signals.

A system configured to determine a characteristic of a polishing pad, comprising:

• a measurement device configured to scan the polishing pad to generate output signals at measurement spots on the polishing pad;
• and
• a processor coupled to the measurement device, wherein the processor is configured to determine the characteristic of the polishing pad from the output signals.

A system configured to characterize a polishing process, comprising:

• a measurement device configured to scan a specimen during the polishing process to generate output signals at measurement spots across the specimen;
• and
• a processor coupled to the measurement device, wherein the processor is configured to determine a thickness of a polishing pad used for the polishing process, wherein the processor is further configured to alter a focus setting of the measurement device in response to the thickness, and wherein the processor is further configured to determine a characteristic of the polishing process from the output signals.

A method for determining a characteristic of a polishing tool, comprising:

• scanning a portion of the polishing tool with a measurement device to generate output signals at measurement spots on the portion of the polishing tool;
• and
• determining the characteristic of the polishing tool from the output signals.

A system configured to determine a characteristic of a polishing tool, comprising:

• a measurement device configured to scan a portion of the polishing tool to generate output signals at measurement spots on the portion of the polishing tool;
• and
• a processor coupled to the measurement device, wherein the processor is configured to determine the characteristic of the polishing tool from the output signals.