Means to eliminate bubble entrapment during electrochemical processing of workpiece surface
OwnerJeffrey Bogart, Bulent Basolinventors
Life of this patent
Estimating the term…
Abstract
Methods and systems are provided to eliminate bubble entrapment during electrochemical processing of a substrate, wherein a rigid plate with fluid openings allow process solution to flow between the front surface of the substrate and an electrode. The plate includes a protruding region. In operation, the protruding region causes a raised solution surface to touch the front surface of the wafer prior to complete immersion of the substrate in the solution. In other embodiments, the raised surface of the solution can be provided by applying pressure to a flexible pad or other workpiece surface influencing device (WSID).
Claims27
A method of immersing a surface of a wafer in a solution for processing the surface, comprising:
- flowing the solution through openings of a rigid plate having a protruding region to form a raised solution surface over the protruding region;
- contacting a selected portion of the wafer surface with the raised solution surface;
- and
- immersing the wafer surface fully into the solution.
A system for eliminating bubble entrapment under a surface of a wafer when the surface is immersed into a process solution to process the surface of the wafer, comprising:
- a rigid plate, having a protruded region and fluid openings, wherein the plate is configured such that as the solution flows through the rigid plate, a raised solution surface forms over the protruded region;
- and
- a moving mechanism configured to move the wafer, wherein as the wafer is moved towards the solution, a selected portion of the surface of the wafer contacts the raised solution surface before immersing the surface fully into the solution.
A method of processing a conductive surface of a wafer using a process solution, comprising:
- flowing the solution through openings of a plate having a protruding region to form a raised solution surface over the protruding region;
- contacting a selected portion of the conductive surface with the raised solution surface;
- immersing the conductive surface fully into the solution;
- and
- processing the conductive surface.
A system for electroprocessing a conductive surface of a wafer using a process solution, comprising:
- an electrode configured to be placed in the process solution;
- a rigid plate, having a protruded region and fluid openings, configured to be immersed in the solution and positioned between the electrode and the conductive surface, wherein the rigid plate is configured such that as the solution flows through the rigid plate, a raised solution surface forms over the protruded region;
- and
- a moving mechanism configured to move the wafer, wherein as the wafer is moved towards the solution, a selected portion of the conductive surface contacts the raised solution surface before immersing the surface fully into the solution.
Dependencies are inferred from the claim text.