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US 2006/0131175 A1Published application
Method for the deposition of an alloy on a substrate
OwnerReiner Anton, Marc Vogelaere +2inventors
InventorsReiner Anton, Marc Vogelaere, Daniel Kortvelyessy, Ralph Reiche
Life of this patent
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Abstract
In previously known electrodeposition methods, alloys can be deposited only badly on a substrate from the components thereof. The inventive method allows an alloy layer to be deposited on a substrate by pulsing the current/voltage used for electrode position.
Claims12
1-9. (canceled)
A method for the electrolytic deposition of an alloy at least two constituents as a layer on a substrate, comprising:
- arranging the alloy in an electrolyte and the at least two constituents of the alloy are suspended and/or dissolved;
- using a plurality of repeated voltage pulses for the electrolytic deposition and combined in a sequence that comprises at least two different blocks;
- adapting one block in each case to a constituent of the alloy to achieve optimum deposition of the constituent and a block comprising two or more voltage pulses, and following a first block of a sequence by a second block in the same sequence of the same polarity and the second block has a higher or lower voltage level on account of being adapted to one constituent of the alloy.
Dependencies are inferred from the claim text.