Process for producing a multi-layer printed wiring board
AssigneeIbiden Co., Ltd.
InventorsYasuji Hiramatsu, Motoo Asai, Naohiro Hirose, Takashi Kariya
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Abstract
A multi-layer printed wiring board includes a board covered with a conductor layer, an interlayer insulating resin layer, an etched metal film on the interlayer insulating resin layer, and a via hole. The interlayer insulating resin layer has a fibrous substrate. The via hole has an electrolytic plated film and an electrolessly plated film and connects the conductor layer of the board and the etched metal film.
Claims16
A multi-layer printed wiring board comprising:
- a board covered with a conductor layer;
- an interlayer insulating resin layer having a fibrous substrate;
- an etched metal film on the interlayer insulating resin layer;
- and
- a via hole comprising an electrolytic plated film and an electrolessly plated film connecting said conductor layer of the board and said etched metal film.
A multi-layer printed wiring board comprising:
- a board covered with a conductor layer;
- an interlayer insulating resin layer comprising a composite of thermo-setting resin and thermoplastic resin;
- an etched metal film on the interlayer insulating resin layer;
- and
- a via hole comprising an electrolytic plated film and an electrolessly plated film connecting said conductor layer of the board and said etched metal film.
A multi-layer printed wiring board comprising:
- a board covered with a conductor layer;
- an interlayer insulating resin layer;
- an etched metal film having 1-20 μm thickness on the interlayer insulating resin layer;
- and
- a via hole comprising an electrolytic plated film and an electrolessly plated film connecting said conductor layer of the board and said etched metal film.
A multi-layer printed wiring board according to claim, 12, wherein
- said via hole is formed by making a hole in the interlayer insulating resin layer with laser, and forming films by electrolytic plating and electroless plating.
Dependencies are inferred from the claim text.