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US 2006/0131069 A1Published application
Method of manufacturing wiring substrate to which semiconductor chip is mounted
AssigneeShinko Electric Industries Co., Ltd.
InventorsNoriyoshi Shimizu, Tomoo Yamasaki, Kiyoshi Oi, Akio Rokugawa
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Abstract
The present invention discloses a method of manufacturing a wiring substrate to which a semiconductor chip mounted. The method includes the steps of forming a base, forming a peeling layer on the base, forming a capacitor having a plurality of layers on the peeling layer, and forming a wiring part in the capacitor for connecting the capacitor to the semiconductor chip.
Claims8
A method of manufacturing a wiring substrate to which a semiconductor chip is mounted, the method comprising the steps of:
- forming a base;
- forming a peeling layer on the base;
- forming a capacitor having a plurality of layers on the peeling layer;
- and
- forming a plurality of wiring parts in the capacitor for connecting the capacitor to the semiconductor chip.
2 more elements
Dependencies are inferred from the claim text.