Surface mounted resistor with improved thermal resistance characteristics
AssigneeStackpole Electronic Inc.
InventorEdward Rodriguez
Life of this patent
Estimating the term…
Abstract
A surface mountable resistor chip assembly, containing an integral heat sink, convective cooling provision exhibits higher continuous-mode power ratings than prior art surface mount resistors having comparable printed circuit board footprints. The preferred embodiments are also configured so as to reduce transient thermal impedance in a manner to exhibit increased power rating under short duration overload conditions. The assembly includes a housing with passages, holes or slotted openings, for the chip assembly and for air flow therethrough, and electrically conductive paths to bring the chip electrical connections out to pads on the housing arranged to make electrical connections to a printed circuit board.
Claims16
A housing structure for mounting an electrical chip, wherein the chip has electrical connection areas, comprising:
- the housing structure consisting of one or more sections of thermally conductive material, which may be selectively painted, plated, anodized or otherwise coated, to define solderable areas,
- the housing contains an opening that accepts the chip allowing electrical contact between the electrically solderable areas of the housing and the electrical connection areas of the chip, and
- electrically conductive pads on the housing suitable for making electrical connections to corresponding pads on a printed circuit board, and electrical conductive paths in the housing making electrical connections between the electrical connection areas of a chip, if mounted, to the electrically conductive pads on the housing.
A structure for surface mounting an electrical circuit or component fabricated on a chip, the electrical circuit or component having at least two electrical connections on the chip, wherein the chip dissipates heat, the structure comprising:
- a housing made of thermally conductive material;
- the housing having a first slotted opening arranged to accept the chip;
- the slotted opening having two internal electrically conductive pads that are electrically isolated from each other, the electrically conductive pads arranged to make electrical contacts with each of the two electrical connections on the chip;
- the housing having at least a second slotted opening that traverse through the structure parallel to the first slotted opening wherein cooling air may pass through each of the slotted openings;
- the housing arranged with two external electrical conductive pads, each arranged to mate with corresponding pads on a printed circuit board;
- and
- electrically conductive paths between one of the internal and one of the external conductive pads, wherein electrical coupling between the printed circuit board and the chip are made.
A housing for mounting one or more electrical chips, wherein each chip has electrical connection areas, the housing comprising:
- two mirror assemblies of thermally conductive material with opening to accept a chip, and a top covering that covers the top surface of the composite assembly, wherein the top of the composite assembly presents a surface with no openings thereby allowing a vacuum to pick up and place the composite assembly, wherein of one or more sections of the thermally conductive material may be selectively painted, plated, anodized or otherwise coated, to define solderable areas;
- electrically conductive pads on the housing suitable for making electrical connections to corresponding pads on a printed circuit board, and electrical conductive paths in the housing making electrical connections between the electrical connection areas of a chip, if mounted, to the electrically conductive pads on the housing;
- wherein the housing is constructed with through passages to allow cooling air to pass, and wherein the surface of the housing exposed to the cooling air is at least 75% greater that the surface area of the chip, and further wherein the mirror extrusions are formed of copper or aluminum sections so shaped and configured with an opening wherein that each can be pushed or snapped or otherwise positioned onto or in close proximity to either side of one or more chips, and wherein an opening is provided that accepts the chip suitable for making electrical contact between the electrically solderable areas of the housing and the electrical connection areas of the chip;
- the opening arranged with integral ridges or other details on the extrusions that accurately define the location of one or more chips when mounted,
- means for thermally but not electrically linking the sections, and
- means for mechanically fixing the sections with respect to each other.
Dependencies are inferred from the claim text.