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US 2006/0131067 A1Published application
PCB, manufacturing method thereof and semiconductor package implementing the same
OwnerHyung-Jik Byun, Yun-Chong Leeinventors
Life of this patent
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Abstract
A method may involve providing a substrate body having an upper surface and a lower surface. Circuit layers may be provided on the upper and the lower surfaces of the substrate body. A prepreg layer may be provided on the upper surface of the substrate body. The prepreg layer may cover the circuit layer on the upper surface. A PCB may be manufactured according to the method. The PCB may be implemented in a semiconductor package.
Claims23
A method comprising:
- providing a substrate body having an upper surface and a lower surface;
- providing circuit layers on the upper and the lower surfaces;
- and
- providing a prepreg layer on the upper surface, the prepreg layer covering the circuit layer on the upper surface.
1 more element
A printed circuit board comprising:
- a substrate body having an upper surface and a lower surface;
- circuit layers provided on the upper and the lower surfaces;
- and
- a prepreg layer provided on the upper surface, the prepreg layer covering the circuit layer on the upper surface.
1 more element
A semiconductor package comprising:
- a printed circuit board including
- a substrate body having an upper surface and a lower surface;
- circuit layers provided on the upper and the lower surfaces;
- and
- a prepreg layer provided on the upper surface, the prepreg layer covering the circuit layer on the upper surface;
- a semiconductor chip mounted on the prepreg layer and electrically connected to the circuit layer on the upper surface;
- a resin sealing provided on the upper surface of the printed circuit board to encapsulate the semiconductor chip;
- and
- solder bumps provided on the lower surface and electrically connected to the semiconductor chip.
6 more elements
A method comprising:
- providing at least one conductive substrate pad on a surface of a substrate body;
- and
- covering the surface with a prepreg layer, the prepreg layer having a window through which the at least one conductive substrate pad is exposed.
A printed circuit board comprising:
- a substrate body having a surface supporting at least one conductive substrate pad;
- and
- a prepreg layer covering the surface, the prepreg layer having a window through which the at least one conductive substrate pad is exposed.
Dependencies are inferred from the claim text.