Heat sink having a high thermal conductivity

A heat sink component, comprising:

• a composite material having
• a diamond content of from 40 to 90% by volume with diamond grains having a mean size of from 5 to 300 μm;
• 0.005 to 12% by volume of a silicon-carbon compound;
• 7 to 49% by volume of an Ag-rich, Au-rich, or Al-rich phase;
• less than 5% by volume of a further phase;
• wherein a volume ratio of said Ag-rich, Au-rich, or Al-rich phase to said silicon-carbon compound is greater than 4, and wherein at least 60% of a surface of said diamond grains is covered by said silicon-carbon compound.

A method of producing a component, which comprises the following process steps:

• producing of an intermediate material containing diamond grains having a particle size of from 5 to 300 μm and a binder based on polymer or wax, and a proportion of the binder being from 1 to 20% by weight;
• shaping the intermediate material by introduction into a mold;
• producing a porous diamond body by heating the intermediate material to from 300° C. to 1200° C. in a protective gas atmosphere for at least partially pyrolyzing said binder;
• effecting an infiltration of the porous diamond body by heating the porous diamond body and a silicon-containing Ag, Au or Al alloy having Si content <40% by weight to a temperature above a liquidus temperature of the silicon-containing Ag, Au or Al alloy, with at least part of the silicon reacting with a carbon of the pyrolyzed binder and with diamond to form silicon carbide.

A method for producing a component, wherein the method comprises the following process steps:

• producing an intermediate comprising diamond grains having a particle size from 5 to 300 μm and a binder based on polymer or wax, with a proportion of binder being from 1 to 20% by weight;
• shaping the intermediate by introduction into a mold at atmospheric pressure or with the aid of a higher pressure;
• producing a porous diamond body by heating the intermediate to a temperature from 300° C. to 1200° C. in a protective gas atmosphere to pyrolyze the binder at least partially;
• heating a silicon-containing Ag, Au or Al alloy having an Si content of <40% by weight to a temperature above a liquidus temperature of the silicon-containing Ag, Au or Al alloy, and effecting a pressure infiltration of the porous diamond body.