Methods and arrangement for the reduction of byproduct deposition in a plasma processing system
AssigneeLam Research Corporation
InventorsShrikant Lohokare, Andrew Bailey
Life of this patent
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Abstract
In a plasma processing system, a method of reducing byproduct deposits on a set of plasma chamber surfaces of a plasma processing chamber is disclosed. The method includes providing a deposition barrier in the plasma processing chamber, the deposition barrier is configured to be disposed in a plasma generating region of the plasma processing chamber, thereby permitting at least some process byproducts produced when a plasma is struck within the plasma processing chamber to adhere to the deposition barrier and reducing the byproduct deposits on the set of plasma processing chamber surfaces.
Claims47
In a plasma processing system, a method of reducing byproduct deposits on a set of plasma chamber surfaces of a plasma processing chamber, comprising:
- providing a deposition barrier in said plasma processing chamber, said deposition barrier is configured to be disposed in a plasma generating region of said plasma processing chamber, thereby permitting at least some process byproducts produced when a plasma is struck within said plasma processing chamber to adhere to said deposition barrier and reducing said byproduct deposits on said set of plasma processing chamber surfaces.
The method of 1 wherein said deposition barrier is configured to protect a set of gas injectors from said byproduct deposits
A method of reducing a set of byproduct deposits on a set of plasma chamber surfaces in a plasma reactor, comprising:
- positioning a substrate in a plasma processing chamber;
- positioning a deposition barrier in said plasma processing chamber, wherein a first plasma is configured to surround said deposition barrier when struck, and whereby said deposition barrier is configured to make contact with a first subset of said set of byproduct deposits from said substrate;
- re-positioning said deposition barrier in said plasma processing chamber, wherein a second plasma is configured to surround said deposition barrier when struck, and whereby said deposition barrier is configured to make contact with a second subset of said set of byproduct deposits from said substrate.
45-70. (canceled)
A deposition barrier arrangement configured to reduce byproduct deposits on a set of plasma chamber surfaces of a plasma processing chamber, comprising:
- a deposition barrier configured to be disposed in a plasma generating region of said plasma processing chamber, said deposition barrier being configured to enable at least some process byproducts produced when a plasma is struck within said plasma processing chamber to adhere to said deposition barrier and thereby reducing said byproduct deposits on said set of plasma chamber surfaces.
72-89. (canceled)
Dependencies are inferred from the claim text.