Cluster tool substrate throughput optimization
AssigneeApplied Materials, Inc.
InventorsLeon Volfovski, Tetsuya Ishikawa
Life of this patent
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Abstract
Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history. In one embodiment, non-orthogonal robot trajectories are used to assure reliable and high speed substrate transfer. In another embodiment, at least one buffering station is used to avoid collision and improve throughput. In another embodiment, optimal positioning of the robots are used to improve throughput.
Claims21
A cluster tool for processing a substrate, comprising:
- a first module comprising:
- a first processing rack having vertically stacked processing chambers;
- a second processing rack having vertically stacked processing chambers, wherein the first and second processing racks are positioned substantially parallel to each other;
- and
- a first robot disposed between the first and second processing racks;
- a second module comprising:
- a third processing rack having vertically stacked processing chambers;
- a fourth processing rack having vertically stacked processing chambers, wherein the third and fourth processing racks are positioned substantially parallel to each other;
- and
- a second robot disposed between the third and fourth processing racks;
- and
- at least one buffering station, wherein the second module is positioned on one side of the first module such that the first processing rack is next to the third processing rack and the third processing rack is next to the fourth processing rack, and the at least one buffering station is disposed in a location so that the at least one buffering station is accessible by both the first and second robots.
A cluster tool for processing a substrate, comprising:
- a first processing rack containing vertical stacks of substrate processing chambers;
- a second processing rack containing vertical stacks of substrate processing chambers;
- a first robot disposed between the first and second processing racks, wherein the first robot is adapted to transfer the substrate among the substrate processing chambers of the first and second processing racks;
- a second robot disposed between the first and second processing racks, wherein the second robot is adapted to transfer the substrate among the substrate processing chambers of the first and second processing racks;
- and
- at least one buffering station disposed between the first and second processing racks and adapted to be accessible by the first and second robots.
A method for processing a substrate in a cluster tool, comprising:
- providing a plurality of processing chambers vertically stacked together;
- providing a first robot configured to transfer substrates among the processing chambers following at least one non-orthogonal trajectory;
- and
- handling the substrate by the first robot to transfer the substrate among the processing chambers.
Dependencies are inferred from the claim text.