Coat/develop module with shared dispense
AssigneeApplied Materials, Inc.
InventorsTetsuya Ishikawa, Rick Roberts
Life of this patent
Estimating the term…
Abstract
An apparatus for dispensing fluid during semiconductor substrate processing operations. The apparatus includes a central fluid dispense bank comprising a plurality of dispense nozzles coupled to a plurality of fluid sources and a first processing chamber positioned to a first side of the central fluid dispense bank. The apparatus also includes a second processing chamber positioned to a second side of the central fluid dispense bank and a dispense arm adapted to translate between the central fluid dispense bank, the first processing chamber, and the second processing chamber.
Claims24
An apparatus for dispensing fluid during semiconductor substrate processing operations, the apparatus comprising:
- a central fluid dispense bank comprising a plurality of dispense nozzles coupled to a plurality of fluid sources;
- a first processing chamber positioned to a first side of the central fluid dispense bank;
- a second processing chamber positioned to a second side of the central fluid dispense bank;
- and
- a dispense arm adapted to translate between the central fluid dispense bank, the first processing chamber, and the second processing chamber.
A method of dispensing fluid onto a semiconductor substrate using an apparatus comprising a central fluid dispense bank including a plurality of dispense nozzles, a first and second processing chamber, and a dispense arm;
- the method comprising:
- selecting a first dispense nozzle from the plurality of dispense nozzles;
- moving the dispense arm to a first position in the first processing chamber;
- dispensing a first fluid from the first dispense nozzle;
- and
- returning the dispense arm to a second position above the central fluid dispense bank.
An apparatus for dispensing fluid during semiconductor processing operations, the apparatus comprising:
- a central fluid dispense bank comprising a plurality of dispense nozzles coupled to a plurality of fluid sources;
- a first processing chamber positioned to a first side of the central fluid dispense bank;
- a first dispense arm adapted to translate between the central fluid dispense bank and the first processing chamber;
- a second processing chamber positioned to a second side of the central fluid dispense bank;
- and
- a second dispense arm adapted to translate between the central fluid dispense bank and the second processing chamber.
A track lithography tool comprising:
- a front end module adapted to receive FOUPs containing a plurality of substrates;
- a central module comprising a plurality of processing tools;
- a rear module coupled to a scanner;
- and
- at least one robot adapted to receive a substrate from the front end module and deliver the substrate to either a processing tool and/or the rear module, wherein one of the plurality of processing tools is an apparatus for dispensing fluid during semiconductor substrate processing operations, the apparatus comprising:
- a central fluid dispense bank comprising a plurality of dispense nozzles coupled to a plurality of fluid sources;
- a first processing chamber positioned to a first side of the central fluid dispense bank;
- a second processing chamber positioned to a second side of the central fluid dispense bank;
- and
- a dispense arm adapted to translate between the central fluid dispense bank, the first processing chamber, and the second processing chamber.
Dependencies are inferred from the claim text.