Method for forming ceramic thick film element arrays with fine feature size, high-precision definition, and/or high aspect ratios
AssigneePalo Alto Research Center Incorporated
InventorsBaomin Xu, Stephen White, Steven Buhler
Life of this patent
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Abstract
A method is provided that includes providing a mold on a temporary substrate, e.g., a sapphire substrate. Next, a material such as PZT paste is deposited into the mold. Then, the mold is removed to obtain elements formed by the mold. The formed elements will then be sintered. After sintering, electrode deposition is optionally performed. The sintered elements are then bonded to a final target substrate and released from the temporary substrate through laser liftoff. Further, electrodes may also be optionally deposited at this point.
Claims32
A method comprising:
- depositing ceramic material into a mold disposed on a temporary substrate;
- removing the mold to obtain molded elements comprising the material;
- sintering the molded elements;
- bonding the molded elements to a target substrate;
- and, removing the temporary substrate.
A method for forming piezoelectric elemental arrays comprising:
- forming a mold on a temporary substrate;
- depositing piezoelectric material into the mold;
- removing the mold to obtain molded piezoelectric elements comprising the piezoelectric material;
- sintering the piezoelectric elements;
- depositing first electrodes on the piezoelectric elements;
- bonding the piezoelectric elements to a target substrate;
- removing the temporary substrate;
- and,
- depositing second electrodes on the piezoelectric elements.
Dependencies are inferred from the claim text.