Packaging structure of LED-multiplexer/driver hybridzation for LED printer head

Abstract

The present invention discloses a packaging structure of LED-multiplexer/driver hybridization for LED printer head. In order to connect the LED-multiplexer module to the LED chip without wire bonding, a multiplexer chip, made of silicon material, has multiplexer circuit on one side and a through engraved U-shape trench on the other side, a linear array LED chip, made of non-silicon material, is stack-hybridized into the through engraved U-shape trench, to form a hybridized wafer with all the upper surfaces of LEDs and the multiplexer circuit in the same plane to form a co-planar surface. A plurality of joint-metal, made by photo-lithography and etching, screen printing of any solder paste, ink-jet printing of any appropriate solder paste or by lift-off method, is formed on said co-planar surface of said multiplexer circuit and linear array LED to connect the bonding pad of the multiplexer device and the positive electrode of the LED of each pixel.

Dependencies are inferred from the claim text.