Interleaved MEMS-based probes for testing integrated circuits
AssigneeSilicon Light Machines Corporation
InventorOmar Leung
Life of this patent
Estimating the term…
Abstract
In one embodiment, a probe card includes a substrate and a plurality of probes. Each of the probes may have a supported portion and an unsupported portion that meet at a base. The unsupported portion may have a non-uniform (e.g. triangular) cross-section along a length that begins at the base. The probes may be interleaved and fabricated using MEMS fabrication techniques.
Claims20
An apparatus for testing an integrated circuit, the apparatus comprising:
- a substrate;
- a plurality of probes formed on the substrate, each of the probes being configured to contact a corresponding pad on a die, each of the probes having a supported portion fixedly attached to the substrate and an unsupported portion that flexes upon contact with a die pad, the unsupported portion having a non-uniform cross-section along a length that begins at a base where the supported portion and the unsupported portion meet.
A method of fabricating a probe for contacting a pad of an integrated circuit die under test, the method comprising:
- forming a sacrificial layer over a substrate;
- forming a compressive layer over the sacrificial layer;
- forming a tensile layer over the compressive layer;
- and
- etching the sacrificial layer using a noble gas fluoride to allow the compressive layer and the tensile layer to curl up.
An apparatus for testing an integrated circuit, the apparatus comprising:
- a first set of probes, the probes in the first set of probes having unsupported portions that begin from bases formed on one side of a first line;
- a second set of probes, the probes in the second set of probes having unsupported portions that begin from bases formed on another side of the first line;
- wherein the first set of probes are interleaved with the second set of probes such that tips of the first and second sets of probes line up substantially along the first line.
Dependencies are inferred from the claim text.