Modularized probe head
AssigneesChipMOS Technologies (Bermuda) Ltd., ChipMOS Technologies Inc.
InventorsAn-Hong Liu, Yeong-Her Wang, Yeong-Ching Chao, Yao-Jung Lee
Life of this patent
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Abstract
A modularized probe head assembly mainly includes a probe head, an interposer and a probe head carrier with guide pins. The probe head has a plurality of first through holes. The interposer has a plurality of second through holes corresponding in location to the first through holes. The probe head carrier is configured to secure the PCB of a probe card and jointing the probe head with the interposer. A via is formed under a pad on the interposer. A plurality of stud bumps are formed on the pad. After assembling of the probe card, the guide pins pass through the first and second through holes and the stud bumps electrically contact the interconnect pad of the probe head.
Claims12
A probe head assembly comprising:
- a probe head having a contact surface, a back surface and a plurality of first through holes;
- a probe formed on the contact surface;
- an interconnect pad formed on the back surface and electrically connected to the probe;
- an interposer having a first surface, a second surface and a plurality of second through holes, the interposer includes at least a first pad on the first surface and at least a via under the corresponding first pad;
- a plurality of bumps bonded onto the first pad;
- and
- a probe head carrier with guide pins for jointing the probe head with the interposer;
- when the probe head carrier is assembled to a PCB, the guide pins pass through the first and second through holes, and the bumps electrically contact the interconnect pad.
An interposer having a first surface, a second surface, comprising:
- a first pad formed on the first surface;
- a second pad formed on the second surface;
- a via electrically connecting the first pad and the second pad;
- and
- a plurality of bumps bonded onto the first pad.
Dependencies are inferred from the claim text.