Modularized probe card for high frequency probing

A modularized probe card comprising:

• a probe head having a probing surface, a back surface and a plurality of cavities on the back surface;
• a plurality of probes fabricated on the probing surface of the probe head;
• a plurality of decoupling components installed in the cavities and electrically connected to the corresponding probes;
• a mounting board having multi-layer circuitries;
• and
• an interposer installed between the probe head and the mounting board, wherein the interposer has a plurality of the first contact ends on a bottom surface thereof, the bottom surfaces of the interposer is aligned to the back surface of the probe head such that the first contact ends electrically contact the corresponding decoupling components,
• wherein the first contact ends include flexible bumps, wherein each flexible bump includes a dielectric body and at least a metal pin around the flexible bumps.