US 2006/0125116 A1 · Multi-chip module

Abstract

A multi-chip module has at least two semiconductor chips. Each of the semiconductor chips has chip electrodes of the semiconductor chip, electrically conductive interconnections for electrically connection with the chip electrodes, electrically conductive lands for electrically connection with the interconnections, external terminals placed on the lands, and a stress-relaxation layer intervening between the lands and the semiconductor chip. The semiconductor chips are placed on a mounting board via the external terminals. The distance between farthest ones of external terminal positioned at an outermost end portions of said second semiconductor chip is smaller than that of the first semiconductor chip.

Claims8

Dependent claims

A multi-chip module in which a plurality of semiconductor chips having semiconductor elements are mounted on a first surface of a mounting board,

wherein, at least first and second semiconductor chips of said plurality of semiconductor chips include chip electrodes, electrically conductive interconnections to electrically connect with said chip electrodes, electrically conductive lands to electrically connect with said interconnections, and first external terminals placed on said lands, said at least first and second semiconductor chips being placed on said mounting board via said first external terminals,
wherein said first semiconductor chip include stress-relaxation layers intervening between said lands and said first semiconductor chip, and
wherein said first semiconductor chip has a distance between farthest ones of its first external terminals larger than a corresponding distance between farthest ones of its first external terminals of said second semiconductor chip.

Dependencies are inferred from the claim text.

Multi-chip module

Life of this patent

Multi-chip module

Life of this patent

Abstract

Claims8