Wafer level ball grid array
AssigneeNational Semiconductor Corporation
InventorsLee Chee, Sri Ganesh A. Tharumalingam
Life of this patent
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Abstract
A manufacturing technique that involves embedding one or more semiconductor die into a support substrate and forming conductive traces that lead from die contact pads to redistributed contact pads on the support substrate. Active surfaces of the dice and a working surface of the support substrate are substantially coplanar and the conductive traces are formed on the coplanar surfaces. The redistributed contact pads are sufficiently spaced apart from each other so that conductive balls can be formed thereon. Individual semiconductor device packages are singulated from the support substrate.
Claims15
A method for manufacturing semiconductor devices comprising:
- molding a plurality of semiconductor dice within a support substrate wherein an active surface of each die is exposed through a working surface of the support substrate, the active surface of each die having a plurality of die contact pads;
- forming conductive traces upon the active surfaces of the dice and the working surface of the support substrate wherein a first end of each conductive trace connects to a respective die contact pad and a second end of each conductive trace forms a redistribution contact pad;
- and
- singulating each semiconductor device from the support substrate wherein each semiconductor device includes at least one semiconductor device, a portion of the support substrate, and at least one conductive trace.
Dependencies are inferred from the claim text.