Electrical connection through nonmetal
AssigneeMedtronic, Inc.
InventorDavid Ruben
Life of this patent
Estimating the term…
Abstract
A low resistance path extends from a first region of a semiconductor substrate to a second region thereof. The low resistance path is produced by depositing a metal such as aluminum on the surface of the substrate and then directing a laser beam onto the metal causing the metal and a portion of the substrate beneath the metal to melt forming an alloy of the metal and the substrate material.
Claims24
A method for producing a conductive path from a first region of a semiconductor material to a second region of said semiconductor material, comprising:
- depositing a metal on at least a portion of said first region;
- and
- directing a laser beam onto said metal to alloy said metal and said semiconductor material to produce a conductive path extending from said first region toward said second region, wherein said second region is a second surface.
A method for providing a low resistance path from a first surface of a die of a semiconductor material to a second surface of the die, comprising:
- depositing a metal on said first surface;
- directing a laser beam onto said metal to create an alloy of said metal and said semiconductor material, said alloy forming said low resistance path extending from said first surface into said die;
- removing a portion of said die to expose said low resistance path at said second surface;
- and
- depositing a conductive material on at least a portion of said second surface to contact with said low resistance path.
A semiconductor device, comprising:
- a semiconductor substrate having first and second regions;
- and
- a low resistance path extending from said first region toward said second region, said low resistance path comprised of an alloy of a metal and a nonmetal.
An electronic device, comprising:
- a substrate material having first and second opposite surfaces;
- at least a first contact pattern comprised of a first metal on said first surface;
- at least a second contact pattern comprised of a second metal on said second surface;
- and
- at least one feed-through contact comprised of an alloy of said first metal and said substrate material for electrically coupling said first contact pattern and said second contact pattern.
A stacked electronic device, comprising:
- a first substrate having a first conductive pattern thereon;
- a second substrate having a second conductive pattern thereon, said second substrate stacked on said first substrate;
- a bump contact electrically coupled to said first conductive pattern;
- and
- at least one feed through conductor comprised of an alloy of a metal and a nonmetal and extending into said second substrate for electrically coupling said bump contact to said second conductive pattern.
Dependencies are inferred from the claim text.