Flip chip device
OwnerWen-Chih Chen, Sheng-Shu Yanginventors
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Abstract
A flip chip device made using LCD-COG (liquid crystal display-chip on glass) technique. The flip chip device comprises a substrate, a plurality of chips having surfaces with a plurality of compliant bumps thereon. The compliant bumps are centrally disposed in the center of the chips for electrically connecting the chips and the substrate. An adhesive is daubed on a joint area of the substrate and the chips for jointing the substrate and the chips. By changing the position of the compliant bumps so that they are centrally disposed on the chips without changing the electrical characteristics and the wiring arrangement of the chips, costs are lowered, reliability is increased and the glass substrate is less easily bent.
Claims17
A flip chip device, comprising:
- a substrate;
- a plurality of chips having surfaces and a plurality of compliant bumps thereon, the compliant bumps are centrally disposed on the center of the chips for electrically connecting the chips and the substrate;
- and
- an adhesive daubed on a joint area of the substrate and the chips for jointing the substrate and the chips.
Dependencies are inferred from the claim text.