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US 2006/0125105 A1Published application
Zinc-aluminum solder alloy
AssigneeFujitsu Limited
InventorsMasayuki Kitajima, Tadaaki Shono, Ryoji Matsuyama
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Abstract
A high melting point solder alloy superior in oxidation resistance, in particular a solder alloy provided with both a high oxidation resistance and high melting point suitable for filling fine through holes of tens of microns in diameter and high aspect ratios and forming through hole filling materials, comprising a zinc-aluminum solder alloy containing 0.001 wt % to 1 wt % of aluminum and the balance of zinc and unavoidable impurities.
Claims4
A zinc-aluminum solder alloy containing 0.001 wt % to 1 wt % of aluminum and a balance of zinc and unavoidable impurities.
Dependencies are inferred from the claim text.