Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
AssigneeSeiko Epson Corporation
InventorsMasakuni Shiozawa, Akiyoshi Aoyagi
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Abstract
A method is provided to suppress detachment between semiconductor packages while preventing dislocation at the time of mounting a stacked semiconductor package on a motherboard. Semiconductor packages PK1 and PK2 are bonded to each other through protruding electrodes and resin is provided between the semiconductor packages PK1 and PK2. The resin is provided in the peripheries of the protruding electrodes so as to contact each of the protruding electrodes while not contacting a semiconductor chip.
Claims3
A method of manufacturing a semiconductor device, comprising:
- bonding a first semiconductor package having a first semicoductor chip mounted therein to a second semiconductor package having a second semiconductor chip mounted therein through protruding electrodes;
- and
- providing resin between the first semiconductor package and the second semiconductor package after bonding of the second semiconductor package to the first semiconductor package;
- wherein at least a part of a surface of the first semiconductor chip is spaced apart from the resin;
- and
- wherein the resin is arranged between the first semiconductor package and the second semiconductor package so as to be spaced apart from the protruding electrode.
A method of manufacturing a semiconductor device, comprising:
- providing flux, which contains resin, on lands formed on a first semiconductor package;
- arranging solder balls, provided on a second semiconductor package, on lands provided with the flux;
- and
- melting the solder balls to bond the solder balls to the lands by executing a reflow process while making the resin contained in the flux crawl up along surfaces of the solder balls.
Dependencies are inferred from the claim text.