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US 2006/0125094 A1Published application
Solder interconnect on IC chip
AssigneeMegica Corporation
InventorMou-Shiung Lin
Life of this patent
Estimating the term…
Abstract
A semiconductor chip suited for being electrically connected to a circuit element includes a line and a bump. The bump is connected to the line and is adapted to be electrically connected to the line. A plane that is horizontal to an active surface of the semiconductor chip is defined. The area that the connection region of the line and the bump is projected on the plane is larger than 30,000 square microns or has an extension distance larger than 500 microns.
Claims21
(canceled)
A semiconductor chip comprising:
- a circuit;
- and
- a bump on said circuit, wherein the area of projecting the contact between said bump and said circuit onto a plane is greater than 30,000 μm2.
A semiconductor chip comprising:
- a circuit;
- and
- a bump on said circuit, wherein the area of projecting the contact between said bump and said circuit onto a plane has an extending distance of greater than 500 μm.
A chip package comprising:
- a semiconductor chip;
- a circuitry component;
- and
- a bump between said semiconductor chip and circuitry component, wherein said bump has a least cross-sectional area parallel to an active surface of said semiconductor chip, wherein said least cross-sectional area is greater than 30,000 μm2.
1 more element
Dependencies are inferred from the claim text.