High density integrated circuit package architecture

An integrated circuit package comprising:

• a first circuitry wafer comprising a substrate on which is carried a first optical IC;
• and
• a first cooling plate layered with the circuitry wafer;
• wherein the first cooling plate comprises a first optically transparent signal path;
• and
• wherein the first optical IC is aligned with the first optically transparent signal path for optical signal communication therethrough.

An integrated circuit package comprising:

• a first circuitry wafer comprising a first substrate on which is carried a first a first optical IC;
• and
• a second circuitry wafer comprising a second substrate on which is carried a second optical IC;
• and
• a first cooling plate layered between the first and second circuitry wafers, the first cooling plate comprising a first optically transparent cooling plate signal path;
• wherein the first optical IC and the second optical IC are aligned with the first optically transparent cooling plate signal path for optical signal communication therethrough.