Connection structure of flexible wiring substrate and connection method using same
AssigneeBrother Kogyo Kabushiki Kaisha
InventorsKoji Imai, Hirosumi Ito
Life of this patent
Estimating the term…
Abstract
A wiring pattern having a plurality of terminal lands and leads independently respectively connected therewith is formed on one face of an insulator of a flexible wiring substrate. The insulator is provided with through-holes whereby the terminal lands are exposed on the other side. The terminal lands are electrically connected and fixed on the other face of the insulator by joining with the head terminals of the inkjet head with conductive adhesive, through the through-holes. Isolation between the leads and terminal lands arranged on the one side thereof from the conductive adhesive is provided by the insulator.
Claims16
A connection structure of a flexible wiring substrate for electrically connecting an inkjet head comprising a plurality of channels that eject ink onto a recording medium and a plurality of head terminals to which a drive signal is applied for ejecting ink from the plurality of channels, to a circuit board that supplies the drive signal that is applied to the inkjet head, wherein
- the flexible wiring substrate has a plurality of terminal lands arranged respectively corresponding to the plurality of head terminals on one face of a strip-shaped insulator having flexibility, a plurality of leads being independently connected with the respective plurality of terminal lands,
- the insulator is provided with a plurality of through-holes in the position of arrangement of the terminal lands, whereby the terminal lands are respectively exposed on the other face of the insulator, and
- the terminal lands and the head terminals are electrically connected by conductive adhesive through the plurality of through-holes.
A connection structure of a flexible wiring substrate for electrically connecting an inkjet head comprising a plurality of channels that eject ink onto a recording medium and a plurality of head terminals to which a drive signal is applied for ejecting ink from the plurality of channels, to a circuit board that supplies the drive signal that is applied to the inkjet head, wherein
- the flexible wiring substrate has a plurality of terminal lands arranged respectively corresponding to the plurality of head terminals on one face of a strip-shaped insulator having flexibility, a plurality of leads being independently connected with the respective plurality of terminal lands,
- the one face of the insulator is covered with an insulating film and a plurality of exposure holes are provided in the insulating film that respectively expose the plurality of terminal lands, and
- the terminal lands and the head terminals being electrically connected by conductive adhesive through the plurality of exposure holes.
A connection method for electrically connecting, through a flexible wiring substrate, an inkjet head comprising a plurality of channels that eject ink onto a recording medium and a plurality of head terminals to which is applied a drive signal for ejecting ink from the plurality of channels, to a circuit board that supplies the drive signal that is applied to the inkjet head, wherein
- the flexible wiring substrate has a plurality of terminal lands arranged respectively corresponding to the plurality of head terminals on one face of a strip-shaped insulator having flexibility, a plurality of leads being independently connected with the respective plurality of terminal lands,
- a plurality of through-holes are provided in the position of arrangement of the terminal lands of the insulator, whereby the plurality of terminal lands are respectively exposed on the other face of the insulator,
- conductive adhesive is arranged on the terminal lands or the head terminals in the through-holes, and the conductive adhesive is semi-hardened by heating,
- the terminal lands and the head terminals are made to face each other, with the adhesive sandwiched therebetween, and these two are connected and fixed with the adhesive that has thus been semi-hardened.
A connection method for electrically connecting, through a flexible wiring substrate, an inkjet head comprising a plurality of channels that eject ink onto a recording medium and a plurality of head terminals to which is applied a drive signal for ejecting ink from the plurality of channels, to a circuit board that supplies the drive signal that is applied to the inkjet head, wherein
- the flexible wiring substrate has a plurality of terminal lands arranged respectively corresponding to the plurality of head terminals on one face of a strip-shaped insulator having flexibility, a plurality of leads being independently connected with the respective plurality of terminal lands,
- the one face of the insulator is covered with an insulating film and a plurality of exposure holes for respectively exposing the plurality or terminal lands are provided in the insulating film,
- conductive adhesive is arranged on the terminal lands or the head terminals in the exposure holes, and the conductive adhesive is semi-hardened by heating, and
- the terminal lands and the head terminals are made to face each other, with the adhesive sandwiched therebetween, and these two are connected and fixed with the adhesive that has thus been semi-hardened.
An inkjet printer, comprising an inkjet head, a circuit board that supplies drive signal that is applied to the inkjet head, and an flexible wiring substrate which electrically connects the inkjet head and the circuit board, the inkjet head comprising a plurality of channels that eject ink onto a recording medium and a plurality of head terminals to which the drive signal is applied for ejecting the ink from the plurality of channels, wherein
- the flexible wiring substrate has a plurality of terminal lands arranged respectively corresponding to the plurality of head terminals on one face of a strip-shaped insulator having flexibility, a plurality of leads being independently connected with the respective plurality of terminal lands,
- the insulator is provided with a plurality of through-holes in the position of arrangement of the terminal lands, whereby the terminal lands are respectively exposed on the other face of the insulator, and
- the terminal lands and the head terminals are electrically connected by conductive adhesive through the plurality of through-holes.
An inkjet printer, comprising an inkjet head, a circuit board that supplies drive signal that is applied to the inkjet head, and an flexible wiring substrate which electrically connects the inkjet head and the circuit board, the inkjet head comprising a plurality of channels that eject ink onto a recording medium and a plurality of head terminals to which the drive signal is applied for ejecting the ink from the plurality of channels, wherein
- the flexible wiring substrate has a plurality of terminal lands arranged respectively corresponding to the plurality of head terminals on one face of a strip-shaped insulator having flexibility, a plurality of leads being independently connected with the respective plurality of terminal lands,
- the one face of the insulator is covered with an insulating film and a plurality of exposure holes are provided in the insulating film that respectively expose the plurality of terminal lands, and
- the terminal lands and the head terminals being electrically connected by conductive adhesive through the plurality of exposure holes.
Dependencies are inferred from the claim text.