Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
AssigneeInternational Business Machines Corporation
InventorsJohn Lee Colbert, Justin Christopher Rogers, Arvind Kumar Sinha
Life of this patent
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Abstract
Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads, under controlled forces, a surface of the bare die into a direct heat transfer relationship at a thermal interface with a heat sink assembly.
Claims22
Apparatus comprising:
- a bare die microelectronic device;
- a heat sink assembly, a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device;
- and, a force applying mechanism that loads, under controlled forces, a surface of the bare die microelectronic device into a direct heat transfer relationship at a thermal interface with the heat sink assembly.
A method of transferring heat from a bare die microelectronic device to a heat sink assembly comprising:
- supporting a heat sink assembly independently of a bare die microelectronic device;
- and, urging a surface of a bare die microelectronic device into direct heat transfer relationship at a thermal interface with a heat sink assembly under controlled forces.
The method of claim 13 further comprising:
- placing a thermal interface material at the thermal interface between the bare die microelectronic device and heat sink assembly.
A computer system comprising:
- a computer housing assembly;
- a printed board mounted in the computer housing assembly;
- a bare die microelectronic device mounted on the printed board;
- a heat sink assembly, a heat sink mounting assembly for mounting the heat sink assembly on the computer housing assembly independently of the bare die microelectronic device;
- and,
- a force applying mechanism that loads, under controlled forces, a surface of the bare die microelectronic device into a direct heat transfer relationship at a thermal interface with the heat sink assembly.
Dependencies are inferred from the claim text.