US 2006/0125086 A1 · Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module

Abstract

A modular heat sink decoupling capacitor array includes a plurality of modules, each defining parallel distributed decoupling plates, and each module forming a heat sink fin. Each module includes multiple spaced apart contacts for providing low inductance connections with an associated device. A power distribution interposer module is attached to a heat sink surface of the modular decoupling capacitor. The interposer module is used for implementing power delivery without using valuable ball grid array (BGA) connections and printed circuit board (PCB) layers.

Claims15

Dependent claims

A modular heat sink decoupling capacitor array comprising:

a plurality of modules defining parallel distributed decoupling plates;
each said module forming a heat sink fin;
and
each said module including a plurality of spaced apart contacts for providing low inductance connections with an associated device.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

11/008,798Filed 9 Dec 2004

Published

15 Jun 2006

Term ends

Not estimatedThe source records don’t support an estimate.

Classification9 codes

H05K 1/0231
Using auxiliary mounted passive components or auxiliary substances: capacitors or dielectric substances
H10W 40/226
Characterised by their shape, e.g. having conical or cylindrical projections: characterised by projecting parts, e.g. fins to increase surface area
H10W 72/00
Interconnections or connectors in packages
H05K 1/0203
Thermal arrangements, e.g. for cooling, heating or preventing overheating: cooling of mounted components

Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module

Life of this patent

Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module

Life of this patent

Abstract

Claims15