Multi-layer interconnection circuit module and manufacturing method thereof

A multi-chip circuit module comprising an interconnection circuit module, one or more semiconductor modules, and one or more printed wiring board modules, wherein said interconnection circuit functions as an interface between the one or more printed wiring board modules and the one or more semiconductor modules and comprises:

• plural unit wiring layers which are interlayer-connected to each other through via holes, and wherein the respective unit wiring layers are composed of one or more insulating layers and a metal wiring layer, and
• wherein a lower most unit wiring layer interfaces with the printed wiring board, and
• wherein an upper most unit wiring layer interfaces with the one or more semiconductor modules, and
• wherein at least one connection between the one or more printed wiring board modules and one of the one or more semiconductor modules is effectuated by a via-on-via structure in which the via formed in each of the unit wiring layers is formed directly over the via of the unit wiring layer below it in order to form a vertical via-on-via structure and to minimize the wiring length of the connection between the printed wiring board and the semiconductor module.

A multi-chip circuit module comprising an interconnection circuit module, one or more semiconductor modules, and one or more printed wiring board modules, wherein said interconnection circuit functions as an interface between the one or more printed wiring board modules and the one or more semiconductor modules and comprises:

• plural unit wiring layers which are interlayer-connected to each other through via holes, and wherein the respective unit wiring layers are composed of one or more insulating layers and a metal wiring layer, and
• wherein a lower most unit wiring layer interfaces with the printed wiring board, and
• wherein an upper most unit wiring layer interfaces with the one or more semiconductor modules, and
• wherein at least one connection between one of the one or more printed wiring board modules and one of the one or more semiconductor modules is effectuated by a continuous direct-through-via formed after each of the unit wiring layers are assembled in order to minimize the wiring length of the connection between the printed wiring board and the semiconductor module.