Printed circuit board
AssigneeKeihin Corporation
InventorsHiroyuki Kamada, Akira Sato
Life of this patent
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Abstract
In a printed circuit board on which a first conductor pattern, a second conductor pattern of smaller area than the first conductor pattern and electronic components are mounted, a gap between a first through-hole connected to the first conductor pattern and a first lead pin inserted therein is defined to be larger than that between a second through-hole connected to the second conductor pattern and a second lead pin. With this, it becomes possible to improve solder rise property, without increasing the number of electronic component production processes or degrading strength with respect to the electronic component.
Claims6
A printed circuit board having at least a first conductor pattern, a second conductor pattern whose area is smaller than that of the first conductor pattern, and electronic components having at least a first lead pin and a second lead pin, comprising:
- a first through-hole formed to be connected to the first conductor pattern for insertion of the first lead pin;
- and
- a second through-hole formed to be connected to the second conductor pattern for insertion of the second lead pin,
- wherein a gap between the first through-hole and the first lead pin is made larger than that between the second through-hole and the second lead pin.
Dependencies are inferred from the claim text.